MediaTek Dimensity 7000 SOC main specifications announced, will be launched in May.
A few weeks ago, MediaTek launched its latest flagship processor, Dimensity 9000, based on the 4nm process to replace the new Snapdragon SoC launched this week. Now, it looks like the company is preparing to announce a new budget chipset located below the flagship SoC.
A popular intelligence agent on Weibo, a digital chat station, revealed the main features of the upcoming Dimensity 7000 SoC in an article. According to the leak, the new MediaTek Dimensity 7000 is said to have a 5nm manufacturing process. It will include four Cortex A78 cores clocked at 2.75GHz and four Cortex A55 cores clocked at 2GHz. The processor will use Mali-G510 MC6 GPU.
Mali-G510 is the successor of Mail G57. Mail G57 has functions on Realme X7, Poco M4 Pro and other mobile phones. According to Arm, Mali-G510 is expected to increase performance by 100% and energy efficiency by 22% compared to Mali G57.
In terms of context, the recently launched Dimensity 9000 is equipped with a Prime X2 core with a clock frequency of 3.05GHz and three Cortex-A710 performance cores with a clock speed 2.85GHz, and four efficiency cores with a clock frequency of 1.8GHz. Graphics and game performance are taken care of by the 10-core Mali-710 GPU.
For the initial leak, it looks like the MediaTek Dimensity 7000 processor will be used for more budget devices, and more certainly, it will be a 5G-enabled SOC, just like the rest of the Dimsnsity lineup. Recent leaks show that the upcoming Redmi K50 series or Redmi phones are expected to use Dimensity 7000 processors.
MediaTek will hold an event in China on December 16 to officially launch Dimsnsity 9000 in China. Although we are not 100% sure yet, the upcoming Dimsnsity 7000 may be announced on the same stage, or at least some information about the brand’s upcoming budget-friendly 5G chipset will be leaked.
