It is reported that Honor Magic 3 will be released in mid-August: benchmarking Huawei Mate.
According to people familiar with the matter, the Honor Magic3 flagship phone will be released in mid-August, equipped with Qualcomm Snapdragon 888 upgraded chip (Snapdragon 888 Plus); this mobile phone product is benchmarked against the Huawei Mate series.
In addition to the Snapdragon 888 Plus chip, the Honor Magic 3 flagship will be equipped with a curved display by BOE and will also use the front camera technology under the screen to achieve a true full-screen effect.
In fact, after the Honor 50 series conference, Honor CEO Zhao Ming mentioned in an interview that Honor Magic 3 has a leading and unique place in terms of design, performance experience, and photography. Several flagships are currently on the market. Although the mobile phone uses the top Snapdragon 888, the experience is a mess.
Zhao Ming said that the Magic series carries the mission of Honor’s high-end brand. This year’s Honor Magic new products will use Snapdragon 888 series chips. He believes that users who want a full-blooded Snapdragon 888 experience can look forward to the Honor Magic 3, which will be launched in the third quarter.
In this regard, Zhao Ming said that the hardware determines the bottom line and bottom line of the performance and experience of Honor mobile phones, and more importantly, the ability to control the hardware. Honor has rich experience and powerful capabilities in this area, so it is for the future development of the Honor Magic series. With strong confidence, it will bring consumers a unique technological experience.
